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?products and specifications discussed here in are for evaluation and re ference purposes only and are subject to change by micron without notice. products are only warranted by micron to meet micron?s production data sheet specifications. 152-ball nand flash and mobile lpdram pop (ti omap) mcp features preliminary ? pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 1 ?2008 micron technology, inc. all rights reserved. nand flash and mobile lpdram 152-ball package- on-package (pop) combination memory (ti omap?) mt29c family current production part numbers: see table 1 on page 3 features ?micron ? nand flash and mobile lpdram components ? rohs-compliant, ?green? package ? separate nand flash and mobile lpdram interfaces ? space-saving package-on-package combination ? low-voltage operation (1.70?1.95v) ? industrial temperature range: ?40c to +85c nand flash-specific features ? organization ? page size x8: 2112 bytes (2048 + 64 bytes) x16: 1056 words (1024 + 32 words) ? block size: 64 pages (128k + 4k bytes) mobile lpdram-specific features ? no external voltage reference required ? no minimum clock rate requirement ? 1.8v lvcmos-compatible inputs ? programmable burst lengths ? partial-array self refresh (pasr) ? deep power-down (dpd) mode ? selectable output drive strength ? status register read (srr) supported 1 figure 1: pop block diagram notes: 1. contact factory for remapped srr output. 2. cl = cas (read) latency. options marking ?lp-dram 166 mhz cl3 2 -6 133 mhz cl3 -75 nand flash device nand flash power nand flash interface lp-dram power lp-dram interface lp-dram device www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 2 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp part numbering information ? 152-ball pop preliminary part numbering information ? 152-ball pop micron nand flash and lpdram devices are available in different configurations and densities. figure 2: 152-ball part number chart note: not all possible combinat ions are available. contac t factory for availability. mt 29c 1g 24m a c j a cg C x it es micron technology product family 29c = nand + lpdram mcp nand density 1g = 1gb 2g = 2gb 4g = 4gb lpdram density 12m = 512mb 24m = 1024mb 48m = 2048mb operating voltage range a = 1.8v (1.70C1.95v) production status blank = production es = engineering sample ms = mechanical sample operating temperature range it = industrial (C40 to +85c) lpdram self refresh current blank = standard lpdram access time C6 166 mhz cl3 C75 133 mhz cl3 package codes ca = 152-ball pop vfbga (14 x 14 x 0.9mm) cg = 152-ball pop vfbga (14 x 14 x 1.0mm) jq = 152-ball pop tfbga (14 x 14 x 1.1mm) nand flash configuration width density generation c x8 1gb first d x16 1gb first j x8 2gb second k x16 2gb second n x8 4gb first p x16 4gb first u x8 1gb second v x16 1gb second chip count ce#, cs# chip count a 1, 1 1 nand, 1 dram b 1, 1 2 nand, 1 dram c 1, 2 1 nand, 2 dram d 1, 2 2 nand, 2 dram lpdram configuration type width density generation j ddr x16 1gb first l ddr x32 1gb first n ddr x16 512mb second r ddr x32 512mb second www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 3 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp device marking preliminary device marking due to the size of the package, the micron-standard part number is not printed on the top of the device. instead, an abbreviated de vice mark consisting of a 5-digit alphanu - meric code is used. the abbreviated device marks are cross-referenced to the micron part numbers at the fbga part marking decoder site: www.micron.com/decoder . to view the location of the abbreviated mark on the device, refer to customer service note csn-11, ?product mark/label,? at www.micron.com/csn . table 1: production part numbers part number nand product lpddr product physical part marking mt29c4g48maplcca-6 it mt46h32m32lfjg-6 it mt29f4g16abcwc-et jw399 mt29c4g48maplcca-75 it mt46h32m32lfjg-6 it mt29f4g16abcwc-et jw400 mt29c4g48maplcjq-6 it mt46h32m32lfjg-6 it mt29f4g16abcwc-et jw297 mt29c4g48maplcjq-75 it mt46h32m32lfjg-6 it mt29f4g16abcwc-et jw296 mt29c1g12madracg-6 it mt46h16m32lfcm-6 it mt29f1g16abbhc-et jw226 mt29c1g12madracg-75 it mt46h16m32lfcm-6 it mt29f1g16abbhc-et jw227 mt29c2g24maklacg-6 it mt46h32m32lfjg-6 it mt29f2g16abdhc-et jw188 mt29c2g24maklacg-75 it mt46h32m32lfjg-6 it mt29f2g16abdhc-et jw189 mt29c1g12mauraca-6 it mt46h16m32lfcm-6 it mt29f1g08abchc-et jw385 mt29c1g12mauraca-75 it mt46h16m32lfcm-6 it mt29f1g08abchc-et jw384 mt29c1g12mavraca-6 it mt46h16m32lfcm-6 it mt29f1g16abchc-et jw375 mt29c1g12mavraca-75 it mt46h16m32lfcm-6 it mt29f1g16abchc-et jw374 www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 4 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp general description preliminary general description micron package-on-package (pop) products combine nand flash and mobile lpdram devices in a single mcp. these products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements. the nand flash and mobile lpdram devices are also members of the micron discrete memory products portfolio. the nand flash and mobile lpdram devices are packaged with separate interfaces (no shared address, control, data, or power ball s). this bus architecture supports an opti - mized interface to processors with separate nand flash and mobile lpdram buses. the nand flash and mobile lpdram devices have separate core power connections and share a common ground (i.e., v ss is tied together on the two devices). the bus architecture of this device also supports separate nand flash and mobile lpdram functionality without concern for device interaction. operational characteris - tics for the nand flash and mobile lpdram devices are found in the standard micron data sheets for each of the discrete devices. for device specifications and complete micron nand flash features documentation, please refer to the component data sheet at www.micron.com/products/nand, or con - tact your local micron sales office. for device specifications and complete mobile lpdram features documentation, please refer to the component data sheet at www.micron.com/prod ucts/mobiledram, or contact your local micron sales office. www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 5 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp ball assignments and descriptions preliminary ball assignments and descriptions figure 3: 152-ball vfbga ball assignments (nand x8; lpddr x16) note: contact factory for availab ility of x16 lpddr configuration. 1 nc nc v ssq nc nc v ssq nc nc v dd we# nc nc nc nc nc nc i/o1 i/o3 ce1# nc nc 1 2 nc nc nc nc nc v ddq nc v ss nc nc re# v ss v cc nc v ss v cc i/o0 i/o2 lock nc nc 2 3 v ddq nc i/o6 i/o4 3 4 ldm nc i/o7 i/o5 4 5 dq5 v ddq wp# nc 5 6 dq7 dq1 v ss v cc 6 7 v ssq dq6 v cc v ss 7 8 dq2 ldqs nc ce0# 8 9 dq4 dq3 nc ale 9 10 dq8 dq0 r/b# cle 10 11 dq11 dq9 v ss v dd 11 12 ck dq10 a14 tq 12 13 v ss ck# cke1 v ss 13 14 udm v ssq v dd v ddq 14 15 v ddq udqs cke0 a13 15 16 dq13 v dd a10 v ssq 16 17 dq12 dq15 v ss v dd 17 18 nc dq14 we# ba0 18 19 nc nc v ssq v ddq 19 20 nc nc nc nc nc v ssq a0 v ss a2 a1 v ddq a7 a8 v ss a5 cs1# cas# ba1 v ssq nc nc 20 21 nc nc nc nc nc v ddq nc v dd a3 a9 v ssq a6 a11 v dd a12 cs0# a4 ras# v ddq nc nc 21 a b c d e f g h j k l m n p r t u v w y aa a b c d e f g h j k l m n p r t u v w y aa top view C ball down nand lpddr supply ground www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 6 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp ball assignments and descriptions preliminary figure 4: 152-ball vfbga ball assignments (nand x16; lpddr x32) 1 nc nc v ssq dq3 dq0 v ssq dq4 dm0 v dd we# nc i/o13 i/o10 i/o12 i/o8 i/o9 i/o1 i/o3 ce1# nc nc 1 2 nc nc dqs0 dq5 dq1 v ddq dq2 v ss i/o14 i/o15 re# v ss v cc i/o11 v ss v cc i/o0 i/o2 lock nc nc 2 3 v ddq dq6 i/o6 i/o4 3 4 dm1 dq7 i/o7 i/o5 4 5 dq13 v ddq wp# nc 5 6 dq15 dq9 v ss v cc 6 7 v ssq dq14 v cc v ss 7 8 dq10 dqs1 nc ce0# 8 9 dq12 dq11 nc ale 9 10 dq16 dq8 r/b# cle 10 11 dq19 dq17 v ss v dd 11 12 ck dq18 rfu tq 12 13 v ss ck# cke1 v ss 13 14 dm2 v ssq v dd v ddq 14 15 v ddq dqs2 cke0 a13 15 16 dq21 v dd a10 v ssq 16 17 dq20 dq23 v ss v dd 17 18 dm3 dq22 we# ba0 18 19 dqs3 dq28 v ssq v ddq 19 20 nc nc dq24 dq25 dq27 v ssq a0 v ss a2 a1 v ddq a7 a8 v ss a5 cs1# cas# ba1 v ssq nc nc 20 21 nc nc dq26 dq29 dq31 v ddq dq30 v dd a3 a9 v ssq a6 a11 v dd a12 cs0# a4 ras# v ddq nc nc 21 a b c d e f g h j k l m n p r t u v w y aa a b c d e f g h j k l m n p r t u v w y aa top view (ball down) nand lp-dram supply ground www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 7 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp ball assignments and descriptions preliminary notes: 1. balls marked rfu may or may not be connec ted internally. these balls should not be used. contact the factory for details. table 2: x8/x16 nand ball descriptions symbol type description ale input address latch enable: when ale is high, addresses can be transferred to the on-chip address register. ce1#, ce0# input chip enable: gates transfers between th e host system and the nand flash device. cle input command latch enable: when cle is high, commands can be transferred to the on-chip command register. lock input when lock is high during power-up, the block lock function is enabled. to disable block lock, connect lock to v ss during power-up, or leave it unconnected (internal pull-down). re# input read enable: gates information from the nand device to the host system. we# input write enable: gates information from the host system to the nand device. wp# input write protect: driving wp# low bloc ks erase and program operations. i/o[7:0] (x8) i/o[15:0] (x16) input/ output data inputs/outputs: the bidire ctional i/os transfer address, data, and instruct ion information. data is output only during read operations; at other times the i/os are inputs. i/o[15:8] are rfu 1 for nand x8 devices. r/b# output ready/busy: open-drain, active-low output that indicates when an internal operation is in progress. v cc supply v cc : nand power supply. www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 8 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp ball assignments and descriptions preliminary notes: 1. balls marked rfu may or may not be connec ted internally. these balls should not be used. contact the factory for details. table 3: x16/x32 lpddr ball descriptions symbol type description a[14:0] input address inputs: specifies the row or column addres s. also used to load the mode registers. the maximum lpddr address is determined by de nsity and configuration. consult the lpddr product data sheet for the maximum address fo r a given density and configuration. unused address pins become rfu. ba1, ba0 input bank address inputs: spec ifies one of the 4 banks. cas# input column select: specifies the command to execute. ck, ck# input ck is the system clock. ck and ck# are differenti al clock inputs. all address and control signals are sampled and referenced on the crossing of th e rising edge of ck wi th the falling edge of ck#. cke0, cke1 input clock enable: cke0 is used for a single lpddr product. cke1 is used for dual lpddr products. cs1#, cs0# input chip select: cs0# is used for a single lpddr product. cs1# is used for dual lpddr products and is considered rfu for single lpddr mcps. ldm, udm (x16) dm[3:0] (x32) input data mask: determines which bytes are written during write operations. for x16 lpddr, unused dm balls become rfu. ras# input row select: specifies the command to execute. we# input write enable: specifies the command to execute. dq[15:0] (x16) dq[31:0] (x32) input/ output data bus: data inputs/outputs. dq[31:16] are rfu fo r x16 lpddr devices. ldqs, udqs (x16) dqs[3:0] (x32) input/ output data strobe: coordinates read/write tra nsfers of data; one dqs per dq byte. for x16 lpddr, unused dqs balls become rfu. tq output temperature sensor output: tq high when lpddr t j exceeds 85c. v dd supply v dd : lpddr power supply. v ddq supply v ddq : lpddr i/o power supply. v ssq supply v ssq : lpddr i/o ground. table 4: non-device-specific ball descriptions symbol type description v ss supply v ss : shared ground. nc ? no connect: not internally connected. rfu 1 ? reserved for future use. www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 9 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp electrical specifications preliminary electrical specifications notes: 1. supply voltage references either v cc ,v dd , or v ddq . stresses greater than those listed under ?absolute maximum ratings? may cause perma - nent damage to the device. this is a stress rating only, and functional operation of the device at these or any other conditions abov e those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect reliability. table 5: absolute maximum ratings parameters/conditions symbol min max unit v cc , v dd , v ddq s upply voltage relative to v ss v cc , v dd , v ddq ?1.0 2.4 v voltage on any pin relative to v ss v in ?0.5 2.4 or (s upply voltage 1 + 0.3v), whichever is less v storage temperature range ? ?55 +150 c table 6: recommended operating conditions parameters symbol min typ max unit supply voltage v cc , v dd 1.70 1.80 1.95 v i/o supply voltage v ddq 1.70 1.80 1.95 v operating temperature range ? ?40 ? +85 c www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 10 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp device diagrams preliminary device diagrams figure 5: 152-ball functional block diagram (single lpddr) ce0# cle ale re# we# wp# lock cs0# ck ck# cke0 ras# cas# we# address, ba0, ba1 v cc i/o r/b# v ss v dd v ddq dm dq dqs tq v ssq nand flash lpddr www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 11 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp device diagrams preliminary figure 6: 152-ball function al block diagram (dual lpddr) ce0# cle ale re# we# wp# cs0#, cs1# ck cke0, cke1 ras# cas# we# address, ba0, ba1 v cc i/o r/b# v ss v dd v ddq dqm dq tq v ss v ssq nand flash lpddr (die 0 and 1) www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 12 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp package dimensions preliminary package dimensions figure 7: 152-ball vfbga (package code: ca) note: all dimensions are in millimeters. ball a1 id 0.46 0.1 seating plane 0.12 a a 0.9 max ball a1 id 0.65 typ 0.65 typ 13 ctr solder ball material: sac105. dimensions apply to solder balls post- reflow on ?0.35 smd ball pads. 152x ?0.45 14 0.1 0.35 min 13 ctr 14 0.1 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 a b c d e f g h j k l m n p r t u v w y aa www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 13 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp package dimensions preliminary figure 8: 152-ball vfbga (package code: cg) note: all dimensions are in millimeters. ball a1 id 0.6 0.1 seating plane 0.1 a a 1.0 max ball a1 id 0.65 typ 13 ctr 14 0.1 solder ball material: sac105. dimensions apply to solder balls post- reflow on ?0.35 smd ball pads. 152x ?0.46 0.35 min 13 ctr 14 0.1 0.65 typ 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 a b c d e f g h j k l m n p r t u v w y aa www.datasheet.net/ datasheet pdf - http://www..co.kr/
8000 s. federal way, p.o. box 6, boise, id 83707-0006, tel: 208-368-3900 www.micron.com/productsupport customer comment line: 800-932-4992 micron and the micron logo are trademarks of micron technology, inc. all other trademarks are the property of their respective owners. preliminary: this data sheet contains initial characterization limits that are subject to change upon full characterization of production devices. 152-ball nand flash and mobile lpdram pop (ti omap) mcp package dimensions pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 14 ?2008 micron technology, inc. all rights reserved. preliminary figure 9: 152-ball tfbga (package code: jq) notes: 1. all dimensions are in millimeters. ball a1 id 0.75 0.1 seating plane 0.12 a a 1.1 max 0.35 min ball a1 id 0.65 typ 0.65 typ 13 ctr 14 0.1 solder ball material: sac105. dimensions apply to solder balls post- reflow on ?0.35 smd ball pads. 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 a b c d e f g h j k l m n p q r t u v w x 152x ?0.45 13 ctr 14 0.1 www.datasheet.net/ datasheet pdf - http://www..co.kr/
pdf: 09005aef8326e5ac / source: 09005aef8326e59a micron technology, inc., reserves the right to change products or specifications without notice. 152ball_ nand_lpdram_j4xx_omap.fm - rev. e 4/09 en 15 ?2008 micron technology, inc. all rights reserved. 152-ball nand flash and mobile lpdram pop (ti omap) mcp revision history preliminary revision history rev. e, preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4/09 ? ?nand flash-specific features? on page 1 : deleted device size bullet. ? figure 2: ?152-ball part number chart,? on page 2 : added u and v options under nand flash configurations; deleted low-power option under lpdram self refresh current; added dimensions to package codes; added cs# to first column under chip count; changed ce# from 2 to 1 for b and d under chip count. ? tabl e 1, ?production part numbers,? on page 3 : replaced former table 1. ? figure 3: ?152-ball vfbga ball assignments (nand x8; lpddr x16),? on page 5 : updated figure. ? figure 4: ?152-ball vfbga ball assignments (nand x16; lpddr x32),? on page 6 : updated figure. ? tabl e 2, ?x8/x16 nand ball descriptions,? on page 7 : updated table. ? tabl e 3, ?x16/x32 lpddr ball descriptions,? on page 8 : updated table. ? tabl e 4, ?non-device-specific ball descriptions,? on page 8 : updated table. ? tabl e 5, ?absolute maximum ratings,? on page 9 : updated table. ? tabl e 6, ?recommended operating conditions,? on page 9 : updated table. ? figure 5: ?152-ball functional block diagram (single lpddr),? on page 10 : updated figure title; updated figure. ? figure 6: ?152-ball functional block diagram (dual lpddr),? on page 11 : added fig - ure. rev. d, preliminary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11/08 ? updated template; ready for external publication. rev. c, preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8/08 ? added part number for jq package code, page 1. ?figure 2, marketing part number example, on page 2: added jq package code. ? added jq package diagram, figure 9, 152-ball tfbga (package code: jq), on page 14 . rev. b, preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4/08 ?on page 1, added part number for ca package code. ?figure 2: marketing part number example on page 2: added ca package code. ? removed former capacitance tables. see component data sheets for capacitance. ? figure 7: 152-ball vfbga (package code: ca) on page 12 , and figure 8: 152-ball vfbga (package code: cg) on page 13 : updated figures. rev. a, preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2/08 ?initial release. www.datasheet.net/ datasheet pdf - http://www..co.kr/

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